Product Features & Description

• Ultra-High Precision: Features a spot size as small as 0.01 mm, allowing for micro-welding of extremely delicate components without causing heat damage to surrounding areas.

• Minimal Heat Input: Uses a narrow pulse width (0.1–20 ms) to create a tiny heat-affected zone (<100 μm). This prevents material degradation and warping, which is critical for thin metals.

• Excellent Hermetic Sealing: Achieves high-performance leak rates (below 5×10⁻⁹ Pa·m³/s), making it the ideal solution for semiconductor, medical, and electronic packaging industries.

• Versatile Material Compatibility: Engineered to weld dissimilar metals with ease, including difficult combinations like copper-aluminum and copper-silicon carbide, as well as highly reflective materials.

• Fast & User-Friendly: The handheld design features intuitive controls and pulse-shaping technology. This reduces setup time and ensures consistent, high-quality results even for operators with minimal training.

Technical Parameters